GZP6830D: Absolute Pressure Type

Product Description

The GZP6830D pressure sensor utilizes a ceramic substrate, housing a packaged pressure sensor and signal conditioning chip. This package digitally compensates for sensor offset, sensitivity, temperature drift, and nonlinearity. An internal signal processor converts the outputs of the pressure and temperature sensor elements into 24-bit and 16-bit data, respectively. Each pressure sensor is individually calibrated and includes calibration coefficients. These coefficients are used in applications to convert measurement results into true pressure and temperature values. Sensor measurements and calibration coefficients are accessible via a serial I2C interface.

The GZP6830D pressure sensor’s internal chip and gold wires are coated with fluorinated silicone, providing resistance to water, moisture, oil, and gas.

The GZP6830D pressure sensor offers fast response, high accuracy, low power consumption, and excellent linearity and stability. Its compact size and ease of installation facilitate system integration, making it widely used in consumer electronics, automotive electronics, fire protection, home appliances, and other civilian applications.

Function Description

This product is manufactured using advanced micro-electromechanical principles. Its core technologies are a MEMS pressure sensor chip based on the silicon piezoresistive effect and a high-performance signal conditioning AISC chip. The silicon micro-piezoresistive MEMS pressure sensor chip forms a Wheatstone bridge through four strain-sensitive resistors. The output signal is amplified, temperature-compensated, and linearized by the ASIC chip. The linearization and temperature compensation of the transfer function are implemented by the digital processing circuit in the ASIC. Through the polynomial compensation algorithm and multi-point pressure calibration technology at multiple temperatures, high-precision pressure measurement is achieved over the entire operating temperature range.