GZP6827D: Differential Pressure Sensor, Gauge Pressure Type

Product Description

The GZP6827D type pressure sensor is packaged in a PCB board format, containing a sealed pressure sensor and a signal conditioning chip. It digitally compensates for the offset, sensitivity, temperature drift and non-linearity of the sensor. It uses a 24-bit ADC and the conditioning chip is equipped with a built-in temperature sensor to output high-precision pressure and temperature values. It also provides an IIC communication protocol interface, with strong anti-interference capability. All measurement data has been fully calibrated and temperature compensated.

The GZP6827D pressure sensor features fast response, high accuracy, excellent linearity, and long-term stability.

With its compact size and grooved pressure interface design, the GZP6827D pressure sensor facilitates easy assembly and sealing for users. It is particularly suitable for wearable devices with limited space.

Function Description

This product is made with advanced micro-electromechanical principles. The crucial technology is the MEMS pressure sensor chip based on the silicon piezoresistive effect and the high-performance signal conditioning AISC chip. The silicon micro-piezoresistive MEMS pressure sensor chip is connected to a Wheatstone bridge composed of four strain-sensitive resistors. The output signal is amplified, temperature compensated and linearized by the ASIC chip. The linearity and temperature compensation of the transfer function are realized by the digital processing circuit in the ASIC. The high-precision pressure measurement in the full operating temperature range is achieved through the polynomial compensation algorithm and multi-point pressure calibration technology at multiple temperatures.